Nondestructive Monitoring of Die Warpage in Encapsulated Chip Packages. Bose, A; Vijayaraghavan, R.K; Cowley, A; Cherman, V; Varela Pedreira, O; Tanner, B.K; Danilewsky, A.N; De Wolf, I; McNally, P.J. IEEE Transactions on Components, Packaging and Manufacturing Technology 2016
NCPST develops and applies advanced plasma measurement techniques for detailed fundamental investigations as well as smart process monitoring and control technologies.
About the Research Area
Plasma diagnostics are important for measuring and monitoring species, mechanisms and for process control. These, often most powerful when combined with simulations, provide understanding and insight of the plasma environment. This understanding is a key element in the development of plasma control strategies and solutions for technological development. Sensing technologies are important for real time monitoring of processes.
Diagnostics in the plasma environment are not trivial and are under continuous development as knowledge and technology advances. Advanced diagnostic techniques often exploit new laser technologies, coupled with atomic and molecular physics understanding. Electrical plasma emission is also a powerful tool for plasma sensing and process control. Combining sensors or diagnostics with advanced data science techniques can additionally help provide greater insight into complex plasma systems.
Diagnostics and Sensors Publications
Measurement of deposition rate and ion energy distribution in a pulsed dc magnetron sputtering system using a retarding field analyzer with embedded quartz crystal microbalance. Sharma, S; Gahan, D; Scullin, P; Doyle, J; Lennon, J; Vijayaraghavan, R.K; Daniels, S; Hopkins, M.B. Review of Scientific Instruments 2016
Development of B-spline X-ray Diffraction Imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips. Wong, C.S; Ivankovic, A; Cowley, A; Bennett, N.S; Danilewsky, A.N; Gonzalez, M; Cherman, V; Vandevelde, B; De Wolf, I; McNally, P.J. Proceedings – Electronic Components and Technology Conference 2014
X-ray diffraction imaging for predictive metrology of crack propagation in 450-mm diameter silicon wafers. Tanner, B.K; Wittge, J; Vagovič, P; Baumbach, T; Allen, D; McNally, P.J; Bytheway, R; Jacques, D; Fossati, M.C; Bowen, D.K; Garagorri, J; Elizalde, M.R; Danilewsky, A.N. Powder Diffraction 2013
Absolute atomic oxygen and nitrogen densities in radio-frequency driven atmospheric pressure cold plasmas: Synchrotron vacuum ultra-violet high-resolution Fourier-transform absorption measurements. Niemi, K; O’Connell, D; De Oliveira, N; Joyeux, D; Nahon, L; Booth, J.P; Gans, T. Applied Physics Letters 2013
Wubetu, GA; Kelly, TJ; Hayden, P; Fiedorowicz, H; Skrzeczanowski, W; Costello, JT. Recombination contributions to the anisotropic emission from a laser produced copper plasma. Journal of Physics B-Atomic Molecular and Optical Physics, 53(6), Article 65701. DOI: 10.1088/1361-6455/ab66d3
Sharma, S; Sirse, N; Sen, A; Turner, MM; Ellingboe, AR. Influence of select discharge parameters on electric field transients triggered in collisionless very high frequency capacitive discharges. Physics of Plasmas, 26(10), Article 103508. DOI: 10.1063/1.5122837