Nucleation and adhesion of ultra-thin copper films on amino-terminated self-assembled monolayers. Bogan, J; Brady-Boyd, A; Armini, S; Lundy, R; Selvaraju, V; O’Connor, R. Applied Surface Science 2018
Our materials growth and processing research develops novel materials and processing methods directed towards applications in high-tech microelectronics, sensing, and sustainability, working in collaboration with key industrial and scientific partners.
About the Research Area
Novel materials coupled with precision processing techniques enable unique functional devices on sub-micron and nanometre length scales. The ability to work at the interface of materials growth and processing, and to utilise a wide variety of processing techniques, including non-equilibrium plasma methods, enables us to access a broad range of parameter space and to develop innovative new materials, composites and structures suited to specific applications. Our wide range of analysis and characterisation techniques provide us with detailed understanding of the scientific basis of the material and device behaviour and these techniques are designed to maximise their relevance to the high-tech manufacturing sector by replicating industrial conditions to give our work maximum impact.
Research Projects
Materials Growth and Processing Publications
Fabrication of A356-based rolled composites reinforced by Ni–P-coated bimodal ceramic particles. Kheirifard, R; Beigi Khosroshahi, N; Azari Khosroshahi, R; Taherzadeh Mousavian, R; Brabazon, D. Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications 2018
Recent developments in surface science and engineering, thin films, nanoscience, biomaterials, plasma science, and vacuum technology. Mozetič, M; Vesel, A; Primc, G; Eisenmenger-Sittner, C; Bauer, J; Eder, A; Schmid, G.H.S; Ruzic, D.N; Ahmed, Z; Barker, D; Douglass, K.O; Eckel, S; Fedchak, J.A; Hendricks, J; Klimov, N; Ricker, J; Scherschligt, J; Stone, J; Strouse, G; Capan, I; Buljan, M; Milošević, S; Teichert, C; Cohen, S.R; Silva, A.G; Lehocky, M; Humpoliček, P; Rodriguez, C; Hernandez-Montelongo, J; Mercier, D; Manso-Silván, M; Ceccone, G; Galtayries, A; Stana-Kleinschek, K; Petrov, I; Greene, J.E; Avila, J; Chen, C.Y; Caja-Munoz, B; Yi, H; Boury, A; Lorcy, S; Asensio, M.C; Bredin, J; Gans, T; O’Connell, D; Brendin, J; Reniers, F; Vincze, A; Anderle, M; Montelius, L. Thin Solid Films 2018
Physical, chemical and electrical characterisation of the diffusion of copper in silicon dioxide and prevention via a CuAl alloy barrier layer system. Byrne, C; Brennan, B; Lundy, R; Bogan, J; Brady, A; Gomeniuk, Y.Y; Monaghan, S; Hurley, P.K; Hughes, G. Materials Science in Semiconductor Processing 2017