Use of X-ray topography to map mechanical, thermomechanical and wire-bond strain fields in packaged integrated circuits. McNally, Patrick J; Rantamaki, R; Curley, John W; Tuomi, T; Danilewsky, A.N; Herbert, P.A.F. Materials Research Society Symposium – Proceedings 1998

Leave a Reply

Your email address will not be published. Required fields are marked *

Fill out this field
Fill out this field
Please enter a valid email address.
You need to agree with the terms to proceed