Non-destructive X-Ray mapping of strain & warpage of die in packaged chips. Stopford, J; Henry, A; Manessis, D; Bennett, N; Horan, K; Allen, D; Wittge, J; Boettcher, L; Cowley, A; McNally, P.J. EMPC-2011 – 18th European Microelectronics and Packaging Conference, Proceedings 2011

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